Substrate coated with a thermal insulation layer

摘要

Substrate (1) coated with a heat protective layer comprises a metal layer (3), a dielectric lower layer (2) arranged between the metal layer and the substrate, and a dielectric upper layer (4) arranged on the side of the metal layer facing away from the substrate. The dielectric lower layer has a first layer (2a) containing an oxide, nitride or oxynitride of bismuth (Bi), tungsten (W) and/or titanium (Ti). The dielectric upper layer has a layer containing an oxide or oxynitride of aluminium (Al), silicon (Si) and/or zirconium (Zr).