| 摘要 |
PROBLEM TO BE SOLVED: To attain compaction by enhancing a formation density of wiring which is formed on an insulating substrate. SOLUTION: A wiring formation groove is approximately spirally formed on an upper surface of an insulating substrate 12, and wiring 14 are continuously formed approximately spirally on side surfaces in the wiring formation groove 16. Therefore, the width of wiring 14 in the direction of surface of the insulating substrate 12 can be suppressed approximately to the thickness of wiring 14, so that the width of wiring 14 in the direction of surface of the insulating substrate 12 can be remarkably reduced. Thus, the formation density of wiring 14 on the upper surface of the insulating substrate 12 can be remarkably enhanced, so that an antenna device 11 can be made compact as a whole. COPYRIGHT: (C)2005,JPO&NCIPI
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