| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily uniformize the plane state of a wafer by uniformizing a wafer polishing rate while suppressing a cost increase. <P>SOLUTION: A region B not formed with grooves 2a is provided at the center part of a polishing pad 2, and a region A formed with the grooves 2a is provided on the outside. The outer peripheral part of the wafer 3 is surrounded and held by a retainer ring 4a, and a part of a portion in proximity to the retainer ring 4a, of the outer peripheral part with a tendency toward a high polishing rate is arranged to face the region B not formed with the grooves 2a. The wafer 3 and the polishing pad 2 are rotated in the same direction while pressing the wafer 3 to the polishing pad 2. Slurry is supplied from a slurry supply means 7 to the outside of the region B not formed with the grooves 2a. Since slurry is hardly supplied to the region B not formed with the grooves 2a, the polishing rate becomes low, and the polishing rate is uniformized over the whole wafer 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
