| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of an electronic component with which mechanical strength in the horizontal direction of a bump bonding part is improved, and which is applied to an optical semiconductor chip and an MEMS substrate where resin cannot be sealed, and also to provide the electronic component manufactured by such manufacturing method. SOLUTION: A first Au bump 6 is formed on the MEMS substrate 2 (step S1). A second Au bump 8 whose size is larger than the first Au bump 6 is formed on a circuit board 4 (step S2). A recessed part is formed on the top of the second Au bump 8 (step S3). Au/Sn is imprinted on a recessed part top face of the second Au bump 8 (step S4). The first Au bump 6 and the second Au bump 8 are position, and the top of the first Au bump 6 is engaged with the recessed part of the second Au bump 8 (step S5). Peripheral boundary parts of engagement parts are bonded and the electronic component is manufactured (step S6). COPYRIGHT: (C)2005,JPO&NCIPI |
