| 摘要 |
PROBLEM TO BE SOLVED: To enclose a semiconductor device in an electronic element package at low temperature. SOLUTION: The electronic element package 1 comprises a resin substrate 9 having a cavity (recess) 99, a semiconductor element 71 mounted on the bottom of the cavity 99 in the resin substrate 9, and a resin cover 2 forming an internal space 90 which encloses the semiconductor element 71 in collaboration with the resin substrate 9 when attached to the substrate 9 for closing the opening of the cavity 99. The substrate 9 and the resin cover 2 have a gold-made substrate metal 31 and a gold-made cover metal 32, respectively. The temperature of the substrate metal 31 and the cover metal 32 is set at room temperature or higher but≤150°C, and the two metals are cleaned by irradiation with a high-speed atom beam in a decompressed environment. The two are then brought into contact with each other for a low-temperature bonding of the substrate 9 and the cover 2. As the result, the semiconductor element 71 low in heat resistance is accommodated in the enclosed internal space 90. COPYRIGHT: (C)2005,JPO&NCIPI
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