| 发明名称 |
Semiconductor component arrangement with an insulating layer having nanoparticles |
| 摘要 |
The present invention relates to a semiconductor arrangement which has a layer structure with at least one semiconductor chip, a carrier for the semiconductor chip and an electrically insulating insulating layer, the insulating layer comprising nanoparticles of an electrically insulating material.
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| 申请公布号 |
US2005133863(A1) |
申请公布日期 |
2005.06.23 |
| 申请号 |
US20040916137 |
申请日期 |
2004.08.11 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
WERNER WOLFGANG;OTREMBA RALF |
| 分类号 |
H01L23/14;H01L23/373;H01L23/495;(IPC1-7):H01L27/108 |
主分类号 |
H01L23/14 |
| 代理机构 |
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| 主权项 |
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