| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated layer type polishing pad for chemical-mechanical polishing which is hard to break away, is low in cost, can be manufactured, and has a window for detecting an end. <P>SOLUTION: The resilient laminated-layer-type polishing pad for chemical-mechanical polishing is disclosed. The polishing pad includes a base layer and polishing layer which are bonded with a hot melt adhesive. The hot melt adhesive has the polishing pad T type peeling strength more than 40 N in 305 mm/ min, and the layer breakaway of pad reduces. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
