| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus that can simultaneously hold and solder components to be mounted on a printed board, that also prevents solder from melting in an already soldered area, and that realizes the mounting of the components to be mounted without causing the positional deviation thereof, when soldering is performed. SOLUTION: The soldering apparatus is equipped with a heating iron tip 3a for soldering and a heat-radiating iron tip 3b having a large heat capacity capable of cooling a component 5 to be mounted. The heating iron tip 3a and the heat-radiating iron tip 3b are designed to be movable for the purpose of holding the component 5 as a pair and to be thermally insulated from each other. COPYRIGHT: (C)2005,JPO&NCIPI
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