Mehrschichtige Leiterplatte

摘要

The present invention provides a multilayer circuit board for mounting thereon a semiconductor chip or other electronic elements having electrode terminals or other connection terminals which are arranged in a grid, staggered, or close-packed manner in an improved form to enable reduction in the number of the wiring layers for lead wiring lines, thereby facilitating the production of multilayer circuit boards and providing an improved product reliability. The multilayer circuit board comprises: a base board having a mounting surface for mounting thereon a semiconductor chip and/or other electronic elements having lattice-arranged connection terminals; connection terminal pads (8) arranged on the mounting surface to form a plane lattice corresponding to the lattice arrangement of the connection terminals and having lattice sites each occupied by one of the connection terminal pads (8); lead wiring lines (7) lying on the mounting surface and having one end connected to the connection terminal pads (8) and the other end extending outwardly from the plane lattice; and the said plane lattice having a peripheral zone including periodic vacant lattice areas (A) formed by vacant lattice sites (10) occupied by no connection terminal pads (8).