发明名称 HIGH THERMAL-CONDUCTIVITY PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a novel high thermal-conductivity printed circuit board which can have an excellent thermal conductivity to quickly radiate heat on a circuit, can effectively reduce noise generated in the printed circuit board by forming a filter using a substrate, and can provide a sufficient function to the filter due to the excellent heat radiation performance of the substrate. SOLUTION: In a high thermal-conductivity printed circuit board 1, a plurality of conductive layers 12A, 12B are laminated on a carbon substrate 10 with insulating layers 11A, 11B laminated therebetween. A through-hole 13 is formed in the high thermal-conductivity printed circuit board 1. A filler material 14 containing carbon microcoils 141 mixed therein is buried in the through-hole 13 so that the plurality of conductive layers 12A, 12B are connected to each other and the filler material 14 is insulated from the inner peripheral surface 131 of the through-hole. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005167131(A) 申请公布日期 2005.06.23
申请号 JP20030407308 申请日期 2003.12.05
申请人 SUZUKI SOGYO CO LTD 发明人 NAKANISHI MOTOYASU
分类号 H05K1/16;H01L23/12;H05K1/02;H05K1/03;H05K1/11;(IPC1-7):H05K1/02 主分类号 H05K1/16
代理机构 代理人
主权项
地址