| 摘要 |
PROBLEM TO BE SOLVED: To perform bonding by a conductive material while hot pressing at a uniform temperature. SOLUTION: A plurality of conductor patterns 2 of copper are formed on the base film 1 of a flexible circuit board, a protective film is formed on the conductor patterns 2, a plurality of lands 4 plated at a part where the conductor pattern 2 is exposed are formed in the vicinity of the end of the flexible circuit board, a heat dissipating member 5 composed of metal foil is bonded to the rear surface of the base film 1 with a nonconductive adhesive, the heat dissipating member 5 is shaped into an isosceles triangle, the vertex of two equal length sides is located in the vicinity of a part being hot-pressed by a hot press tool 17, and the side facing that vertex is made parallel with a line connecting the plurality of lands 4. COPYRIGHT: (C)2005,JPO&NCIPI |
