发明名称 |
Ceramic chuck |
摘要 |
An object of the present invention is to provide a ceramic chuck for mounting a wafer so that the number of particles adhered onto the wafer after chucking can be reduced while maintaining a desired Young's Modulus of the chuck. A ceramic chuck 1 has a surface layer 2 contacting a wafer "W" and a substrate portion 6. The surface layer 2 and substrate portion 6 are produced by co-sintering and the surface layer 2 has a porosity of 1% or higher and 10% or lower and larger than that of the substrate portion 6.
|
申请公布号 |
US2005128674(A1) |
申请公布日期 |
2005.06.16 |
申请号 |
US20040003285 |
申请日期 |
2004.12.03 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
OHASHI TSUNEAKI;YAMADA NAOHITO;SUGIMOTO HIROYA |
分类号 |
H01H1/00;H01L21/68;H01L21/683;H02N13/00;(IPC1-7):H01H1/00 |
主分类号 |
H01H1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|