| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board in which the scattering of solder can be suppressed when a welding object member is welded to a metal piece mounted on a substrate. SOLUTION: The circuit board A1 comprises a substrate 1, a conductive pad 4a formed on the substrate 1, and a metal piece 3 bonded to the pad 4a through a solder layer 6 and provided on the surface thereof with a welding object member 5. At least a part between the welding object 3a of the metal piece 3 and the substrate 1 is formed as an air gap 7 and the welding object 3a is spaced apart from the solder layer 6 through the air gap 7. COPYRIGHT: (C)2005,JPO&NCIPI |
