| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor element which can simply manufacture a semiconductor element having bumps whose heights are almost equal. SOLUTION: A semiconductor element is manufactured by a manufacturing method which is provided with a first process and a second process. In the first process, on a plurality of barrier metal layers 3 which are dotted on a semiconductor substrate 1, a printing mask 6 having apertures 7 which correspond to the barrier metal layers 3 is arranged, conductive paste 5' is placed on the printing mask 6, a squeegee 9 is moved on the printing mask 6, the conductive paste 5' is spread on the barrier metal layers 3 through the apertures 7, and after that the bumps 5 are formed by heating the spread conductive paste 5'. In the second process, a pushing mask 10 wherein the aperture 7 does not exist at least on the bump 5 is arranged on the bump 5, a squeegee 11 is moved on the pushing mask 10, the pushing mask 10 is pushed to the bump 5 by thrust from the squeegee 11, and the upper surface of the bump 5 is flattened. COPYRIGHT: (C)2005,JPO&NCIPI
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