| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring substrate which can reduce the sedimentation of filler constituents in a curing process of sealing resin, and a heat treatment device. <P>SOLUTION: Heat treatment is carried out while rotating a substrate 11 having a sealer 15 comprising a filler 17 and a liquid resin material 16, and a semiconductor chip 13 arranged on the sealer 15 on the major surface thereof. The sedimentation of the filler 17 in the sealer 15 can be restrained by rotating the substrate 11 in heat treatment, thus dispersing the filler 17 uniformly. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
