| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit component contained module wherein an electromagnetic-field shield layer can be formed simply without using any metal cover, and environmental assessment is also considered. <P>SOLUTION: The circuit component contained module has a circuit component 104 composed of one or more electronic components and has a wiring board 102 having electrodes 103 for mounting the circuit component on its surface layer and having one or more wiring layers. Further, in the module, the circuit component 104 and the electrodes 103 of the wiring board 102 are connected with solder or a conductive adhesives 105, and these are covered with an insulating resin 107. Moreover, conductive foil 114 is so formed on the surface layer of the insulating resin 107, and the conductive foil 114 and grounding patterns 111 of the wiring board 102 are so connected electrically by using conductive substances 115 as to form an electromagnetic-field shield layer in the module. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
