发明名称 Plasma processing apparatus
摘要 A plasma processing apparatus capable of extending a period of maintenance and continuing stable processing is provided. The apparatus comprises a vacuum reactor 1 having a processing gas introduction device and a evacuating device, a shield electrode 14 formed on the outer circumferential wall of the vacuum reactor, and a specimen placing device 101 having an antenna electrode 51 for radiating high frequency power into the vacuum reactor, in which first high frequency power is supplied to the antenna electrode, and high frequency power at a frequency lower than that of the first high frequency power is supplied to the antenna electrode 51 and the shield electrode 15.
申请公布号 US2005126711(A1) 申请公布日期 2005.06.16
申请号 US20040764528 申请日期 2004.01.27
申请人 KAZUMI HIDEYUKI;MAEDA KENJI;YOSHIDA TSUYOSHI;OYAMA MASATOSHI 发明人 KAZUMI HIDEYUKI;MAEDA KENJI;YOSHIDA TSUYOSHI;OYAMA MASATOSHI
分类号 H05H1/46;B01J3/00;B01J19/08;C23F1/00;C23F4/00;H01J37/32;H01L21/3065;(IPC1-7):C23F1/00 主分类号 H05H1/46
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