| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for manufacturing a semiconductor device in which an aging variation of a contamination or adhesion physical properties to the semiconductor device is small with high antistatic performance in the adhesive film to be finally removed in a method of manufacturing a semiconductor device. SOLUTION: The adhesive film for manufacturing semiconductor device has an adhesive layer and a heat resistant base material layer in such a manner that the adhesive layer contains a conductive filler and an adhesive. The adhesive film for manufacturing the semiconductor device is used for the method of manufacturing semiconductor device including (a) a step of forming a conductor on the adhesive film, (b) a step of mounting a semiconductor chip on the conductor, (c) a step of wiring the semiconductor chip to the conductor, (d) a step of sealing the semiconductor chip with the sealing resin, and (e) a step of removing the adhesive film. COPYRIGHT: (C)2005,JPO&NCIPI
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