| 摘要 |
A capacitive fingerprint sensor against ESD damage and contamination interference includes a substrate, a plurality of plate electrodes, a metal mesh, a plurality of ESD units, a plurality of bonding pads, and a protection layer. The plate electrodes, bonding pads and metal mesh are positioned on the substrate at the same level, and are composed of the same material. The ESD units are connected to the metal mesh that is conducted to the ground, and are exposed via a plurality of first openings. Thus, electrostatic charges from a finger may be discharged through this path to the ground. The metal mesh is covered by the protection layer and is not exposed. The number of the ESD units is far less than that of the plate electrodes so as to reduce the contamination interference on the captured fingerprint image.
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