| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has high adhesion strength to lead frames and excellent soldering resistance, and to provide a semiconductor device. SOLUTION: This epoxy resin composition for encapsulating semiconductors is characterized by comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a triazinethiol structure-having compound such as 2-dipropylamino-4,6-mercapto-s-triazine. The epoxy resin composition for sealing semiconductors, wherein the triazinethiol structure-having compound is more preferably contained in an amount of 0.004 to 2 wt.% based on the total weight of the resin composition. The semiconductor device is characterized by sealing a semiconductor element with the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI |
