发明名称 |
DUAL STAGE PRE-HEATER |
摘要 |
<p>A system for electronic component 20 processing, including: a frame 11 configured to hold a printed circuit board 25; a tool head 12 connected to the frame 11, the tool head 12 being configured to position an electronic component 20 on top of the printed circuit board 25; a heater 14 disposed in the tool head 12, the heater 14 being configured to direct heat towards the electronic component 20; and a dual-stage pre-heater 30 connected to the frame 11, the dual-stage pre-heater 30 being configured to direct heat towards the printed circuit board 25, wherein the pre-heater 30 comprises: a first stage 32 configured to direct heat over a wide area of the printed circuit board 25; and a second stage 34 configured to heat a focused region of the printed circuit board 25 adjacent to the electronic component 20.</p> |
申请公布号 |
WO2005048676(A1) |
申请公布日期 |
2005.05.26 |
申请号 |
WO2004US33492 |
申请日期 |
2004.10.13 |
申请人 |
DELAWARE CAPITAL FORMATION, INC.;HO, ALBERT;CARLOMAGNO, MIKE;MISHIN, ARTEM |
发明人 |
HO, ALBERT;CARLOMAGNO, MIKE;MISHIN, ARTEM |
分类号 |
H05K13/04;(IPC1-7):H05K13/04 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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