| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small-sized micro-optical device package for communication with airtightness at a low cost. <P>SOLUTION: In the micro-optical device package 500, optical devices 12, 18, 22 and 32 are disposed on a micro-optical bench 100 where a surface processing area is formed such as grooves where the optoelectronic devices 12, 18, lenses 22, 32, a fiber 42 and a lid 200 are disposed, and thereafter the lid 200 having a sidewall 220 which light penetrates is disposed on the optical micro-bench 100 by keeping airtightness. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
