SEMICONDUCTOR WAFER WITH NON-RECTANGULAR SHAPED DICE

摘要

A semiconductor wafer (10) having a plurality of dice (111-114) formed on the wafer. The plurality of dice having non-rectangular shapes with at least one notched corner. A plurality of saw streets are defined between the plurality of dice. At an intersection of two of the plurality of saw streets, a distance is defined between corners of two adjacent dice that is greater than a minimum distance between the two adjacent dice.