发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To easily manufacture a semiconductor light emitting device that can emit light with high luminance by making a relatively large current to flow. <P>SOLUTION: A supporting plate (1) provided with a recessed section (5) having a bottom face (6) and a reflecting surface (7) expanded outward from the bottom face (6) on its top surface (8) is prepared and disposed in the cavity (31) of a forming mold (30), by blocking up the recessed section (5) of the plate (1) with the top face of the cavity (31) of the forming mold (30) by bringing the top surface (8) of the plate (1) into contact with the top face of the cavity (31). Then the top surface (8) of the supporting plate (1) except the recessed section (5) and at least a pair of facing side faces (11 and 12) of the plate (1) are coated with resin sealants (4) by injecting a fluidized resin into the cavity (31). After the supporting plate (1) is taken out of the forming mold (30), the semiconductor light emitting device is completed. The supporting plate (1) provided with the light-reflective reflecting surface (7) can be press-molded integrally, and the flowing of the resin into the recessed section (5) can be prevented certainly when the resin is molded. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005129640(A) 申请公布日期 2005.05.19
申请号 JP20030362041 申请日期 2003.10.22
申请人 SANKEN ELECTRIC CO LTD 发明人 TSUKAGOSHI KOJI;YOKOTA TSUTOMU
分类号 H01L33/48;H01L33/56;H01L33/64 主分类号 H01L33/48
代理机构 代理人
主权项
地址