| 摘要 |
An apparatus for plating a wire material is provided in which a range of the plated layer where the temperature is high and flowability is large, thus, easily generating thickness deviation, and a range of the plated layer where the temperature is low and the flowability is small, thus generating thickness deviation only with difficulty are allowed to cool in an appropriate manner, respectively, whereby a plated wire material whose thickness deviation is not more than 2.0 can be produced with high productivity in a stable manner. In an apparatus for plating a wire material having an air cooling device provided on an upper portion of a plate-squeezing portion on a plating bath surface so that the wire material is standing up from the plating bath via the plate-squeezing portion, the air cooling device comprising an air compressor portion, a lower cooling portion below the air compressor portion, and an upper cooling portion above the air compressor potion; the wire material passing through the air cooling device is air-cooled in two stages by a main cooling air flowing from an air injection hole of the air compressor portion into the upper cooling portion then flowing out from the upper cooling portion from an exit at an upper end and by a secondary cooling air, being sucked into the main cooling air, flowing from an inlet of the lower cooling portion at the lower end thereof into the lower cooling portion and then being jointed to the main cooling air.
|
