发明名称 ELECTRONIC PART MOUNTING DEVICE AND ELECTRONIC PART MOUNTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic part mounting device and an electronic part mounting method which can cope with two embodiments of die bonding and flip chip bonding by the same device. <P>SOLUTION: In an electronic part mounting device, electronic parts supplied to a part supply part 10 in a face-up state are taken out to be mounted on a board 3. A flip chip 13 supplied by a first holding table 11A is taken out by a take-up head 9 and is transferred to a mounting head 4 in an upside-down state to be mounted on the board 3. A die 14 supplied by a second holding table 11B is directly picked up by the mounting head 4 to be mounted on the board 3. Thus, it is possible to cope with two embodiments of die bonding and flip chip bonding by the same device. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005123638(A) 申请公布日期 2005.05.12
申请号 JP20040334148 申请日期 2004.11.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ARIKADO KAZUO
分类号 H05K13/04;H01L21/52;H01L21/60;H01L21/67;H01L21/68;H05K13/08 主分类号 H05K13/04
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