发明名称 SEMICONDUCTOR INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent such damages as cracks and crazes even if a high load is added to a semiconductor device at the time of an electric inspection of a semiconductor device. SOLUTION: To contact terminals 14, two or more contact pieces 14b provided with slope sections 14a formed inward with sharply pointed projecting tip shape are arranged upright so as to be opened or closed inside or outside. When contact terminals 14 contact ball electrodes 13 of a semiconductor device 17 at the time of inspection, the contact area to ball electrodes 13 is made to increase by contacting the contact pieces 14b at the pointed tip so as to open along with ball electrodes 13, and obtain the stabilized contact also by a low load. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005121525(A) 申请公布日期 2005.05.12
申请号 JP20030357884 申请日期 2003.10.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OGAWA TAKASHI;OIDA SHIGEJI;NAKAZAWA TOSHIYUKI;OMORI HIROHARU;YUGAWA MASAYUKI;SAKAGUCHI SHIGEKI
分类号 G01R31/26;(IPC1-7):G01R31/26 主分类号 G01R31/26
代理机构 代理人
主权项
地址