METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS USING A FLEXIBLE PRESSURE ELEMENT

摘要

The invention relates to a method for partially encapsulating with encapsulant an assembly of a carrier with an electronic component connected thereto, comprising the processing steps of: A) enclosing at least a part of the carrier and the electronic component mounted thereon between a mould part and a counter-mould part, B) introducing a liquid encapsulant into the mould cavity, and C) removing the carrier with encapsulated electronic component from the mould parts after at least partial curing of the encapsulant. The invention also relates to a device for applying such a method.