| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding wire that has a core material composed mainly of copper and a coating layer formed on the core material, can form highly stable balls, and causes little short-tail defects, particularly, nonadhesion defects; and to provide an integrated circuit device using the wire. <P>SOLUTION: The bonding wire has the core material composed mainly of copper and the coating layer formed on the core material. The coating layer is composed of an oxidation-resistant metal having a higher melting point than the core material has. In addition, the 0.2% proof stress of the bonding wire is adjusted to 0.115-0.165 mN/μm<SP>2</SP>. The integrated circuit device uses this bonding wire. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
