| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for interlayer connection of a multilayer flexible wiring board which can solve many problems associated with the conventional technology that are needed to be eliminated, such problems including a complicated interlayer connection process requiring many number of processes, the occurrence of short circuits due to ion migration caused by using different media such as plating, solder, and conductive paste for connection, insufficient connection strength, difficulty of visual inspection immediately after the connection process, and environmental problem caused by using lead plating and lead solder which have often been used. SOLUTION: The multilayer flexible wiring board has such a structure that a plurality of metal foil layers are laminated via a resin layer for insulation. Laser is irradiated on a portion of the wiring board which needs interlayer connection, and thereby the metal foils in the laser irradiated portion are welded, resulting in electrically connecting the metal foil layers. COPYRIGHT: (C)2005,JPO&NCIPI
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