发明名称 BINDING STRUCTURE USING REACTED BOROSILICATE MIXTURE
摘要 FIELD: binding ceramics, semiconductors, and metals together. ^ SUBSTANCE: reacted borosilicate mixture is proposed for securing various parts on substrate at high temperatures and for their sealing to protect them against detrimental impact of environment. ^ EFFECT: enhanced strength and reliability of joints. ^ 10 cl, 9 dwg
申请公布号 RU2251174(C1) 申请公布日期 2005.04.27
申请号 RU20030127745 申请日期 2002.01.07
申请人 发明人 PARSONS DZHEJMS D.
分类号 G01J5/04;G01J5/02;G01J5/12;G01J5/14;H01L21/58;H01L21/66;H01L23/29;H01L23/31;H01L23/544 主分类号 G01J5/04
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