| 发明名称 |
Thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same |
| 摘要 |
The present invention relates to a thermoconducting silicone composition having a viscosity at 25° C. before curing of 10-1,000 Pa.s, a method of installing the composition, and a heat dissipating structure comprising the silicone composition.
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| 申请公布号 |
US6884660(B2) |
申请公布日期 |
2005.04.26 |
| 申请号 |
US20020316078 |
申请日期 |
2002.12.11 |
| 申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
TETSUKA HIROAKI;YAMADA KUNIHIRO;MITA KUNIHIKO |
| 分类号 |
C08L83/04;B23K31/00;C08K3/00;C08K3/08;C08K3/10;C08K5/5415;C08L83/05;C08L83/07;C09K5/14;H01L23/34;H01L23/36;H01L23/40;(IPC1-7):H01L23/34 |
主分类号 |
C08L83/04 |
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