| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing method of wire bonding device which can relax a force working on wire or the like due to difference in thermal expansion coefficients and can protect connection parts between electrode pads and wires for an external force. SOLUTION: The wire bonding device comprises a heater board 10, a driver IC 30, electrode pads (not illustrated) formed on respective wiring members 40, and wires 60 for electrically connecting respective electrode pads. Connecting points between the electrode pads and wires 60 are sealed with a first sealing agent 90, having comparatively higher hardness, after the hardening. Portions, other than the connecting points between the wires 60 and electrode pads, are sealed with a second sealing agent 100 having comparatively lower hardness, after the hardening. COPYRIGHT: (C)2005,JPO&NCIPI |
