发明名称 APPARATUS AND METHOD FOR MEASURING AND APPLYING COEFFICIENTS OF THERMAL EXPANSION AND CONTRACTION
摘要 PROBLEM TO BE SOLVED: To measure the coefficients of thermal expansion and contraction of a thin film, and to apply the results. SOLUTION: While keeping a sample 60 at a constant temperature by heating by a heater 21, a thin-film sample 20 is irradiated with an X-ray emitted from an X-ray source 10, and a reflected X-ray is detected by an X-ray detector 30. The film thickness of a thin film 61 at a predetermined temperature is calculated from the detected X-ray reflectance. Then, the film thickness of the thin film 61 is calculated at elevated temperatures. From thus obtained film thickness for each temperature, the coefficients of thermal expansion and contraction of the thin film is determined. Thin film-curing conditions can be determined from measured coefficients of thermal expansion and contraction, by arbitrarily programming temperature raising/lowering. Being incorporated into a multi-chamber system, film forming conditions can be controlled. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005106810(A) 申请公布日期 2005.04.21
申请号 JP20040232165 申请日期 2004.08.09
申请人 TOKYO ELECTRON LTD 发明人 KAWAMURA SHIGERU
分类号 G01B15/02;G01N23/20;G01N25/16;H01L21/66;(IPC1-7):G01N23/20 主分类号 G01B15/02
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