| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin build-up printed wiring board which can be produced at a high manufacturing yield, and a method for manufacturing the thin build-up printed wiring board at a high manufacturing yield. SOLUTION: The build-up printed wiring board, in which the thickness of all insulating layers is 50μm or smaller, comprises at least one insulating layer, a first conductive pattern formed on a surface on one side of a first outermost insulating layer which is an outermost layer on one side of at least one insulating layer, and a second conductive pattern formed on a surface on the other side of a second outermost insulating layer, which is the outermost layer on a side opposite to the one side of at least one insulating layer. All non-through via holes for interlayer connection which are formed in at least one insulating layer are in a non-through type on the other side. COPYRIGHT: (C)2005,JPO&NCIPI |
