发明名称 NON-CONTACT TYPE IC LABEL
摘要 <P>PROBLEM TO BE SOLVED: To prevent non-contact type IC label from being easily reused when it is peeled off from an article or the like after it is pasted onto the article or the like and used, regardless of the mechanical strength of the members which constitute a circuit. <P>SOLUTION: A resin sheet 116 in which an antenna 112 and land sections 114 are formed and an IC chip 111 connected to the antenna 112 is mounted, and a film substrate 118 in which a bridge 117 is formed to form an electrically conductive pattern to write and read information to and from the IC chip 111 in a non-contact manner by being coupled to the antenna 112 are adhered by an adhesive layer 120b at a relative position such that the land sections 114 and land sections 115 are electrostatically coupled. On the back surface of the film substrate 118, an adhesive layer 120c having tacky power that is stronger than the tack power of an adhesive layer 120a and the adhesive layer 120b is laminated. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005107176(A) 申请公布日期 2005.04.21
申请号 JP20030340775 申请日期 2003.09.30
申请人 TOPPAN FORMS CO LTD 发明人 YAMAGAMI TAKESHI
分类号 B42D15/10;G06K19/077;G06K19/10;G09F3/00;G09F3/03;G09F3/10 主分类号 B42D15/10
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