| 摘要 |
PROBLEM TO BE SOLVED: To repair disconnections by surely suppressing the increase of wiring resistance. SOLUTION: For example, power source lines 124 which are formed on the same substrate 10 and are set at the same potential as each other are subjected to defect inspection right after the formation thereof and repair wiring 128 is formed by directly covering the power source lines 124 so as to connect the loss defective (disconnected) portions thereof. The repair wiring 128 can be formed by scanning disconnected ends 124d1 and 124d2 with a laser beam in a gaseous atmosphere of a conductive material, such as, for example, tungsten, so as to connect these ends to each other and drawing the same. The disconnections of the power source lines 124 are repaired by directly covering the same, by which the increase of the wiring resistance is suppressed and the flatness on the repair wiring 128 is additionally improved. COPYRIGHT: (C)2005,JPO&NCIPI
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