| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology for manufacturing a multimedia card with a stable outside dimension. <P>SOLUTION: Chips 4 and 5 are mounted on principal planes of respective wiring boards 1, and bonding pads formed on the principal planes of the chips 4 and 5 and pads on the principal planes of the wiring boards 1 are electrically connected one another via bonding wires 6 and 7. After a sealing part 8 is formed by sealing the chips 4 and 5 and the bonding wires 6 and 7 on the respective wiring boards 1, a joint part between the respective wiring boards 1 is cut, and consequently, the multimedia card is manufactured. In formation of the sealing part 8, the outside dimension of the wiring board 1 and that of the sealing part 8 on the wiring board 1 are set to that of the finished multimedia card. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
