发明名称 APPARATUS AND METHOD FOR PLATING BOTH SIDES
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for simultaneously forming plating layers with different thicknesses on both sides of a tabular substrate, and to provide a method for plating both sides. SOLUTION: The apparatus for simultaneously forming the plating films on both sides of the tabular substrate 33 comprises a plating tank 22 for storing a plating liquid 31; and a holder 23 for plating, which holds the tabular substrate 33 in a state of contacting both sides with the plating liquid, and separates the plating liquid 31 stored in the plating tank 22 into two regions while cooperating with the tabular substrate 33. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005097721(A) 申请公布日期 2005.04.14
申请号 JP20040057497 申请日期 2004.03.02
申请人 YAMAHA CORP 发明人 YASUTAKE HIDETOSHI
分类号 C25D5/16;C25D17/00;C25D21/12;(IPC1-7):C25D5/16 主分类号 C25D5/16
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