| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing apparatus capable of easily controlling circulating gas in dry etching. SOLUTION: A processing apparatus 100 comprises a shower head 200 which supplies a processing gas into a process chamber through a plurality of gas support holes, a turbo pump 120 which exhausts the process gas from the process chamber 110, and a circulating gas piping 150 for returning at least a part of the gas (circulating gas Q2) exhausted from the process chamber by the turbo pump to the shower head. The shower head comprises a primary gas supply system which supplies a primary gas Q1 supplied from a gas source 140 into the process chamber through a plurality of primary gas blowout holes h1, and a circulating gas supply system that supplies the circulating gas into the process chamber through a plurality of circulating gas supply holes. The primary gas supply system and the circulating gas supply system are independent from each other, and the ratio in area between the primary gas support hole and the circulating gas support hole is constant across the entire surface of the gas supply mechanism. COPYRIGHT: (C)2005,JPO&NCIPI
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