发明名称 RESIN FORMULATION, USES THEREOF, AND MOULDED BODY PRODUCED THEREFROM
摘要 The invention relates to a resin formulation based on an epoxy resin, said formulation containing mixtures of bisphenol F or bisphenol A diglycidyl ethers with higher-functional epoxy-phenol novolaks, and exhibiting constant thermomechanical properties over a wide range. An amine constituent which is in the form of a hardener and linked to another hardener constituent or an initiator constituent is added to the resin formulation, the hardener constituents being solid at room temperature.
申请公布号 WO2005033172(A1) 申请公布日期 2005.04.14
申请号 WO2004EP52232 申请日期 2004.09.17
申请人 SIEMENS AKTIENGESELLSCHAFT;CASSIGNOL, CAROLINE;LEHNER, BARBARA;WIPFELDER, ERNST;UEBLER, WOLFGANG 发明人 CASSIGNOL, CAROLINE;LEHNER, BARBARA;WIPFELDER, ERNST;UEBLER, WOLFGANG
分类号 C08G59/18;C08L63/00 主分类号 C08G59/18
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