发明名称 Nitride-based semiconductor light emitting device and method of manufacturing the same
摘要 <p>Provided are a nitride-based light emitting device and a method of manufacturing the same. The nitride-based light emitting device has a structure in which at least an n-cladding layer (130), an active layer (140), and a p-cladding layer (150) are sequentially formed on a substrate (110). The light emitting device further includes an ohmic contact layer (230) composed of a zinc (Zn)-containing oxide containing a p-type dopant formed on the p-cladding layer. The method of manufacturing the nitride-based light emitting device includes forming an ohmic contact layer composed of Zn-containing oxide containing a p-type dopant on the p-cladding layer, the ohmic contact layer being made and annealing the resultant structure. The nitride-based light emitting device and manufacturing method provide excellent I-V characteristics by improving ohmic contact with a p-cladding layer while significantly enhancing light emission efficiency of the device due to high light transmittance of a transparent electrode.</p>
申请公布号 EP1523047(A2) 申请公布日期 2005.04.13
申请号 EP20040256154 申请日期 2004.10.05
申请人 SAMSUNG ELECTRONICS CO. LTD.;GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 SEONG,TAE-YEON;SONG, JUNE-O;KIM, KYOUNG-KOOK;LEEM, DONG-SEOK
分类号 H01L33/42;H01L33/06;H01L33/10;H01L33/32;(IPC1-7):H01L33/00 主分类号 H01L33/42
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