| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can suppress the dripping and bending of a wire and a short circuit between semiconductor chips and wires which tend to occur when wire secondary bonding is performed for a bump which is formed in advance, and to provide its manufacturing method. <P>SOLUTION: In a stack structure wherein a plurality of semiconductor chips are stacked on a lead frame die pad 4, when the secondary bonding of a wire 5a is performed for a bump 6 which is formed in advance on an electrode pad of a chip 2 of an upper layer, a bending point 8 is provided near the bump 6 and a wire is laid toward the bump 6 having an angle obliquely downward therefrom. As for the shape of the bump 6, a projection is formed at the primary bonding side of an upper part of the bump 6 wherein the wire 5a is subjected to secondary bonding. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
