| 摘要 |
A composite apparatus provided with a power amplifier and a duplexer for improving the heat sink function is provided to prevent the frequency transition phenomena due to the heat by blocking the transmission of the high temperature generated at the power amplifier to the other circuit such as the duplexer. A composite apparatus provided with a power amplifier and a duplexer for improving the heat sink function includes a printed circuit board(PCB), a first and a second ground electrode(GA,GB), a power amplifying unit(51), a duplexer(54), and an impedance matching device(55). The PCB is formed by stacking a plurality of dielectric layers and includes a mounting surface and a bottom surface. The first and the second ground electrode(GA,GB) are formed on the bottom surface of the PCB. The power amplifying unit(51) is mounted on the PCB, and is connected to the first ground electrode(GA) through the first via hole(VH11) penetrating from the mounting surface of the PCB to the bottom surface and amplifies the transmission signal. The duplexer(54) is mounted on the PCB and is connected to the second ground electrode(GB) through the second via hole(VH12) penetrating from the mounting surface of the PCB to the bottom surface, and is provided with a reception filter and a transmission filter. And, the impedance matching device(55) is formed in the shape of conductive pattern and connected between the reception filter and the transmission filter of the duplexer(54) to match the impedance between the reception filter and the transmission filter. |
