Punching device and workpiece processing method

摘要

A punching device of the present invention is proposed which can perform positional alignment with high accuracy without generating positional deviation or vibration by shifting a workpiece, and which does not deteriorate the accuracy of determining the position of an image by shifting a photographic device. In this punching device, a CCD camera, which can photograph the position of the die hole upon the lower die and the position of the pattern upon the workpiece which shows the position thereon where punching is to be performed, is fixedly provided at a position removed from the raising and lowering track of the punch plate. Furthermore, a mirror may be provided between the CCD camera and the die hole upon the lower die.