| 摘要 |
<p>PURPOSE: A tape carrier for a chip-on-film and a chip-on-film apparatus are provided to improve productivity and yield of a chip-on-film apparatus using the tape carrier by 20 percent by shorten an interval of time for filling epoxy resin, and to prevent an integrated circuit device from being deteriorated by connecting the chip-on-film apparatus to a heat radiating device. CONSTITUTION: Insulated tape(711) is prepared. A plurality of interconnection patterns(721) are formed on the insulated tape. Solder resist(731) is applied to the upper surface of the insulated tape to seal a part of the interconnection patterns. Leads at one end of the interconnection patterns is electrically connected to electrode pads formed in the integrated circuit device. When the connected electrode pads and leads are sealed by using resin, an opening(741) for injecting the resin is formed in the insulated tape such that the opening is smaller than the area of the integrated circuit device.</p> |
