发明名称 CU-NI THICK-FILM RESISTOR, FORMING METHOD THEREOF, AND MANUFACTURING METHOD OF CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a Cu-Ni thick-film resistor having a small amount of residual carbon and reduced variations in resistance and TCR characteristics in order to eliminate an organic constituent in paste by performing heat treatment in oxidizing atmosphere. <P>SOLUTION: Conductive material powder is made of at least one kind of the mixed powder of Cu and Ni, alloy powder, and/or the oxide of them. In Cu-Ni paste, the conductive material powder and glass powder are dispersed in a vehicle. The Cu-Ni paste is applied onto an insulating substrate for performing the heat treatment in the oxidizing atmosphere to eliminate an organic matter, thus creating the Cu-Ni thick-film resistor having a small amount of residual carbon and a small amount of variation in resistance and TCR characteristics. Additionally, a Cu oxide oxidized by heat treatment in the oxidizing atmosphere and/or an Ni oxide is reduced in a reduction atmosphere, and then is baked in a neutral atmosphere or a reduction one for manufacturing a resistor. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005085907(A) 申请公布日期 2005.03.31
申请号 JP20030314722 申请日期 2003.09.05
申请人 TDK CORP 发明人 IGARASHI KATSUHIKO;TANAKA HIROBUMI
分类号 H05K1/16;H01C7/00;H01C17/06;(IPC1-7):H01C7/00 主分类号 H05K1/16
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