发明名称 |
Methods and apparatus for bonding substrates |
摘要 |
<p>A substrate bonding method for mutually bonding substrates, has a first radiation step for irradiating the surfaces of the individual substrates with an oxygen particle beam, a second radiation step for irradiating the surfaces of the individual substrate with a nitrogen particle beam simultaneously with or subsequently to the first radiation step, and a step for stacking the individual substrates and bringing the surfaces thereof into close contact. Particularly, the substrates which have been irradiated first with an oxygen plasma and subsequently with a nitrogen plasma are stacked and bonded.</p> |
申请公布号 |
EP1518669(A2) |
申请公布日期 |
2005.03.30 |
申请号 |
EP20040019770 |
申请日期 |
2004.08.20 |
申请人 |
SUGA, TADATOMO;AYUMI INDUSTRY CO., LTD. |
发明人 |
SUGA, TADATOMO;KIM, TAEHYUN;ABE, TOMOYUKI |
分类号 |
B32B37/18;H01L21/02;B32B38/00;H01J37/32;H01L21/18;H01L21/20;H05H1/24;(IPC1-7):B32B31/04;B32B31/00 |
主分类号 |
B32B37/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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