CONDUCTIVE PARTICLE, SEALANT, SEMICONDUCTOR MODULE, ELECTRONIC EQUIPMENT, METHOD OF MANUFACTURING CONDUCTIVE PARTICLE, METHOD OF MANUFACTURING SEALANT, AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
摘要
<p><P>PROBLEM TO BE SOLVED: To join a terminal electrode to a projecting electrode while a sufficient number of conductive particles are secured on the joint surface of the terminal electrode. <P>SOLUTION: A semiconductor chip 1 is flip-chip mounted on a wiring board 11 by joining the projecting electrode 5 to the terminal electrode 12 through a sealing resin 13 in which conductive particles 14 having projecting sections 15 capable of piercing into the projecting electrode 5 are mixed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
