| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film deposition system and a film deposition method capable of keeping a low melting point substrate at a fixed temperature and capable of performing high temperature film deposition to a plastic substrate having a low melting point for solving the problem that, conventionally, the application of a film deposition process equal to that for a glass substrate also to a plastic substrate has been difficult since the heat resistance temperature of the plastic substrate is limited to around 80 to 100°C, and the problem that, in a warming/cooling unit with large heat capacity, the responsiveness of temperature control has been inferior, and the holding the substrate temperature constant has been difficult. SOLUTION: In a thin film deposition system where a low melting point substrate is used for film deposition, a means capable of subjecting the low melting point substrate to heating and cooling from both of surface and rear sides is provided. COPYRIGHT: (C)2005,JPO&NCIPI
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